JPH0197622A - 樹脂成形品の真空成形装置 - Google Patents
樹脂成形品の真空成形装置Info
- Publication number
- JPH0197622A JPH0197622A JP25577087A JP25577087A JPH0197622A JP H0197622 A JPH0197622 A JP H0197622A JP 25577087 A JP25577087 A JP 25577087A JP 25577087 A JP25577087 A JP 25577087A JP H0197622 A JPH0197622 A JP H0197622A
- Authority
- JP
- Japan
- Prior art keywords
- station
- vacuum forming
- base material
- molding
- resin sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title claims abstract description 37
- 229920005989 resin Polymers 0.000 title claims abstract description 37
- 238000000465 moulding Methods 0.000 title claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 45
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 238000007666 vacuum forming Methods 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 2
- 230000032258 transport Effects 0.000 claims 2
- 238000009966 trimming Methods 0.000 abstract description 3
- 239000003638 chemical reducing agent Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
Landscapes
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25577087A JPH0197622A (ja) | 1987-10-09 | 1987-10-09 | 樹脂成形品の真空成形装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25577087A JPH0197622A (ja) | 1987-10-09 | 1987-10-09 | 樹脂成形品の真空成形装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0197622A true JPH0197622A (ja) | 1989-04-17 |
| JPH0554808B2 JPH0554808B2 (en]) | 1993-08-13 |
Family
ID=17283378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25577087A Granted JPH0197622A (ja) | 1987-10-09 | 1987-10-09 | 樹脂成形品の真空成形装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0197622A (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7056770B2 (en) * | 2002-11-26 | 2006-06-06 | Towa Corporation | Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4831504B2 (ja) * | 2010-02-09 | 2011-12-07 | 新東工業株式会社 | 熱可塑性樹脂シートの成形設備 |
-
1987
- 1987-10-09 JP JP25577087A patent/JPH0197622A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7056770B2 (en) * | 2002-11-26 | 2006-06-06 | Towa Corporation | Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0554808B2 (en]) | 1993-08-13 |
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